A bit of a continuation from the post yesterday. Today I received a package tools required for the re-balling of BGA chips. First up is a jig for 90mm stencils. Seems of quite high quality, will be interesting to see how well it works. Although, I think skill will probably be the more deciding factor with regard to that.
Next up are the 90mm stencils themselves. I have not opened the pack for these yet. But the description for this particular pack states that it has stencils for all the common chips that need replacing on the PS3, Wii and Xbox 360. These seem of quite high quality also
Next is a vacuum pickup tool from one of the better Chinese brands Atten. This will be essential in extracting chips off the motherboard once they are reflowed. It works by pressing and holding the button on the side and then pressing the suction cup to the surface of the chip and releasing. This seems to be of moderate quality in terms of the build quality.
Finally, we have a big jar of 0.6mm solder balls, which will be good for Xbox 360 GPUs. Not that re-balling is a fix for RROD problems, but I have a few scrap consoles on hand, so it is what I am going to start with to get some practice in. Other things that are required for this such as Kapton tape, flux and tweezers I already have. Should have everything I need now for when the machine arrives, which should not be too far away. Then I can get to modding :-)